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Following the e-Therm 2008 held in June 2008, e-Therm 2010, "2nd International Symposium on Thermal Design and Thermophysical Property for Electronics and Energy" will be held from 15 to17 December, 2010 at AIST Tsukuba central in Tsukuba city, Japan.

This symposium is planned for providing an opportunity to present papers and discuss a control and effective use of heat support sustained growth of society and industry in energy and electronics fields. The fields of application include thermal design and thermal countermeasure for LED, electronic device, semiconductor device, memory storage, flat panel display, power electronics devices and electrical storage device, and saving energy in housing, office and electric appliances. Sophistication of thermal design by improvement of quantification of heat transfer simulation based on reliable thermophysical property data is the keyword. From the viewpoint of development and evaluation of materials with superior thermal functions, sessions on measurement technology and data for thermophysical property of high temperature melt, high temperature electronic ceramics, transparent conductive film, diamond thin film and thermoelectric material will be held. Regarding measurement technology for thermophysical property value, international standard, standardization, traceability, uncertainty and thermophysical property database are focused as technical infrasturucure for thermal science and engineering.

All papers of e-Therm 2010 can be submitted to JJAP special issue.
You are invited to attend and present papers at e-Therm 2010.
Participation fee is free for speakers and audience

What's New

-2010.12. 3 - [update] presentation instruction
-2010.11. 22 - [update] Symposium program
-2010.10. 7 - [update] Speaker and presentation title of Invited Talks
-2010.9. 10 - [update] Submission deadline of abstract is extended.
-2010.8. 30 - [update] Organized Committee and Invited Talks
-2010.8. 6 - [update] Cosuponser information and paper instruction
-2010.8. 3 - [update] Cosuponser information
-2010.7.29- [release] 1st circular and web site

National metrology institute of Japan, AIST


General Chair:
Tetsuya BABA / Japan
National Institute of Advanced Industrial Science and Technology (AIST)

Program Committee
Ali Shakouri / USA
University of California, SantaCruz

Chuan Hu / USA
Research AZ Intel Corp.

Daniel Josell / USA
National Institute of Standards and Technology

Daniela Stroe Gaal / USA
Anter Laboratories, Inc.

Hiroshi Kubota / Japan
Kumamoto University

Hiroyuki Fukuyama / Japan
Tohoku University

Jurgen Blumm / Germany
NETZSCH-Gerätebau GmbH

Kazuaki Yazawa / USA
University of California, SantaCruz

Kiyoshi Hirao / Japan
National Institute of Advanced Industrial Science and Technology (AIST)

Koji Miyazaki / Japan
Kyushu Institute of Technology

Makio Naitoh / Japan
Osaka University

Masaru Ishizuka / Japan
Toyama Prefectural University

Mattias Gustavsson / Sweden
Hot Disk AB

Motoo Fujii / Japan
National Institute of Advanced Industrial Science and Technology (AIST)

Peter E. Raad/ USA
Southern Methodist University

Peter S. Gaal / USA
Anter Laboratories, Inc.

Sang-Hyun Lee / Korea
Korea Research Institute of Standards and Science

Shinichi Shikata / Japan
National Institute of Advanced Industrial Science and Technology (AIST)

Shigeo Maruyama / Japan
University of Tokyo

Venkat Natarajan / India
Intel Technology India Pvt. Ltd.

Yuji Nagasaka / Japan
Keio University

Yuzo Shigesato / Japan
Aoyama Gakuin University

Zhang Xing / China
Tsinghua University

Important date and paper instruction
Paper instruction for Oral/Poster presentation

Submission deadline: 30 September 2010
Notification of acceptance: 8 October 2010
Submission of manuscripts: 19 November 2010

Access info.

AIST logo
Co-supported by


Japanese Society of Thermophysical Properties

The Institute of Electrical Engineers of Japan

The Institute of Electronics, Information and Communication Engineers

Japan Semiconductor Ventures Association

Semiconductor Leading Edge Technologies

Association of Super-Advanced Electronics Technologies

The Japan Society of Mechanical Engineers

Japan Electronics and Information Technology Industries Association

IEEE CPMT Society Japan Chapter

The Japan Society of Applied Physics

Heat Transfer Society of Japan

e-Therm2010 office
Material Properties and Metrological Statistics Division,
National Metrology Institute of Japan,
National Institute of Advanced Industrial Science and Technology
Tsukuba Central 3, Umezono1-1-1, Tsukuba, Ibaraki, 305-8563, Japan
E-mail :     TEL : ++81-29-861-4166     FAX : ++81-29-861-4039

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